1. For Disassemble PCB Chips/Mobile Phone Frame
2. Heating plate with good and well-distributed heat conduction will not be easy out of shape under high temperature 3. Thickened panel with pad |
|
1. For Disassemble PCB Chips/Mobile Phone Frame
2. Heating plate with good and well-distributed heat conduction will not be easy out of shape under high temperature 3. Thickened panel with pad |
|